Ultra High Service Temperature, Structure bonding Epoxy Adhesive

Key Features

● One component ,Ease of use

● High hot strength,Structural bonds at elevated temperatures

● excellent resistance to  chemical,Withstand harsh environment

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Product Description

ELINBOND E105 is a one component, filled, heat cured, black, general purpose epoxy adhesive and sealant which cure rapidly at elevated temperatures. It contains no solvents and requires no additional catalyst. ELINBOND E105  features  excellent resistance to heat, chemical,  water, solvent and excellent dielectric properties .


ELINBOND E105 is designed for bonding metals, glass and rigid plastics. It is special used for high temperature structure bonding or chemical resistance sealing.

Instructions For Use

Thoroughly read the information concerning health and safety contained in this bulletin before using. Observe all precautionary statements that appear on the product label and/or contained in individual Material Safety Data Sheets (MSDS).

To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part. For information on proper substrate preparation, refer to the reprint "Good Adhesive Bonding Starts With Surface Preparation" available from E-Linking.

Apply the adhesive to all surfaces to be bonded and join together. In most applications only contact pressure is required.


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