Potting and Encapsulation

E-Linking potting and encapsulation compounds feature exceptionally low viscosities and are easy to apply.From power supplies to connectors to sensors and relays, E-linking potting and encapsulation compounds optimize performance and provide easy processing. Our line of products consists of epoxies, silicones, polyurethanes and UV curable systems. These polymeric formulations have excellent adhesion, thermal stability and outstanding chemical resistance.

Properties of Potting and Casting Systems

Our technologically advanced potting and encapsulation materials are designed to resist exposure to hostile environmental conditions. They offer the following advantages:

  • High voltage insulation

  • Enhanced thermal management properties

  • Exceptionally low coefficients of thermal expansion

  • Thermal shock resistance

  • Cryogenic serviceability

Special Potting and Encapsulation Formulations

Some of our compounds have been formulated to meet strict industry standards, including:

  • UL 94V-0 for flame resistance

  • NASA low outgassing

  • USP Class VI for medical use

  • FDA CFR 175.300 for food grade

Most Popular Products for Potting and Encapsulation

ELINOPTO E106-5Optically Clear, Two Component Epoxy Adhesive. Optical clarity,Bonding of transparent materials; Long pot-life, Ease of use and less waste; General purpose, Bonds well to glass, metal and plastic substrates.



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