E-linking's metal bonding adhesives offer convenient cure schedules, high performance and long-term durability.From aluminum to cast iron to stainless steel to titanium, E-Linking one and two component adhesive systems meet the challenging needs of metal bonding applications. These job proven formulations are presently employed in applications ranging from design and production to repair, maintenance and field service.
Some of the most commonly used metal substrates include:
Aluminum
Beryllium
Cadmium
Copper
Iron
Magnesium
Nickel
Platinum
Titanium
Zinc
Some of the most commonly used metal alloys include:
Aluminum Alloys
Brass
Bronze
Cast Iron
Invar
Kovar
Nitinol
Stainless Steel
Steel
Types of Metal Bonding Adhesives
E-Linking's metal bonding systems are presently employed in industries ranging from aerospace, optical and electronic to oil/chemical processing, medical and automotive. Available chemistries include:
Epoxies
Silicones
Polyurethanes
Cyanoacrylates
UV cures
Most Popular Products for Metals
| ELINOPTO E203 | |
UV curable ashesive and sealant. Low CTE, low stress; Excellent adhesion, structural bonding to a wide variety of substrates; UV Cure, quick speed UV processing. | |
Optically Clear, Two Component Epoxy Adhesive. Optical clarity,Bonding of transparent materials; Long pot-life, Ease of use and less waste; General purpose, Bonds well to glass, metal and plastic substrates. | |
| ELINBOND S111 | One component,low stress Excellent primerlessadhesion,Structural bonding to a wide variety of substrates Excellent weatherability,Quick speed UV processing |
| ELINBOND S123 | Test |
| ELINBOND E107HF | Halogen Free, High Strength Epoxy Adhesive.Sag resistance,No flow during cure even on vertical surface; Halogen free,Environment friendly,High hot strength, Structural bonds at elevated temperatures. |
| ELINBOND A108 | Low CTE,low stress Excellent adhesion,Structural bonding to a wide variety of substrates UV Cure,Quick speed UV processing |
Strong adhesion,High reliability High Refractive index,Enhance LED lumen No yellowing due to heat and UV light,ong-life LEDs | |
| ELINDUCT A301M | Low Temperature Curing,Conductive Die Attach Adhesive. Thixotropic, Low flow during cure; Excellent electric properties, Reliable electronic assemblies; Fast curing at low temperature, High output and low stress. |
| ELINBOND E103 | One component, Ease of use Very high trength,Provides structural bonding to a wide variety of substrates Non-sag paste,No flow or sag even on vertical surfaces |
| ELINBOND 401 | Test |
Ferrites
