ELINOPTO DA-20C

Dielectric Adhesive For LED Chip Bonding

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Product Description

ELINOPTO DA-20C is a one-component dielectric adhesive, developed for LED chip bonding.  It features good thermal and UV resistance, as well as non-bleeding property. The designed workability can be used by pin transferring, stamping and dispensing processes.

Applications

ELINOPTO DA-20C is designed for LED die attached and mixing phosphor powder.

Instructions For Use

Thoroughly read the information concerning health and safety contained in this bulletin before using. Observe all precautionary statements that appear on the product label and/or contained in individual Material Safety Data Sheets (MSDS).
To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part.
This material is designed for pin transfer, dot dinspensing, and/or syringe applications. Dispense the desired amount of material and place die into deposit using downward force to achieve desired bondline.
Material removed from containers may be contaminated during use. Do not return product to the original container. E-Linking Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.
Please contact E-Linking Technical Service Department for detailed recommendation on adhesive application, including dispensing.

Packaging

Syringes	bottles

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Discuss your application  Request a Technical Data Sheet  Request an MSDS