Epoxy films are available 2 to 8 mils thick and preforms can be laser or die cut to meet any configuration.E-linking’s electronic grade adhesive films and preforms feature noteworthy characteristics including storage stability at ambient temperatures, fast cures, high bond strength and excellent chemical resistance.
Performance Properties of E-linking Adhesive Films and Preforms
Grades of our epoxy films and performs can be adjusted to meet specific requirements of:
Flexibility
Electrical/thermal properties
Temperature & chemical resistance
Successful industry applications include:
Substrate attachment with minimal squeeze out
Heat sink bonding
Lid sealing
Stress absorption
Hybrids
Connectors and other electronic assemblies
EMI/RFI Shielding
Structural bonding
Static dissipation
Benefits of Film and Preform Adhesives
Ready to use
Remains in one place after application
Bondline uniformity
Preforms can be supplied in intricate shapes
Can narrow bondline widths
Suitable for high volume production
One Part Epoxy
