ELINOPTO E122-2

Two Component Epoxy Structural Adhesive

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Product Description

ELINOPTO E122-2 A/B is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is known throughout the world for its performance and reliability. It has reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure. This adhesive complies with the requirements of NASA's Outgassing Specification.

Applications

Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.

Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging
Fiber optic adhesive suggested applications: Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range; Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays 
Medical suggested applications: Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including SST, diamond, titanium, brass, ceramics, glass and most plastics.
Electronics Assembly suggested applications:  Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices. Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.  Structural grade epoxy bonding of metals, kapton, and magnets.

Instructions For Use

Thoroughly read the information concerning health and safety contained in this bulletin before using. Observe all precautionary statements that appear on the product label and/or contained in individual Material Safety Data Sheets (MSDS).
To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part. For information on proper substrate preparation, refer to the reprint “Good Adhesive Bonding Starts With Surface Preparation” available from E-Linking.
Accurately weigh resin and hardener into a clean container in the recommended ratio. Weighing apparatus having an accuracy in proportion to the amounts being weighed should be used.
Blend components by hand, using a kneading motion, for 2-3 minutes. Scrape the bottom and sides of the mixing container frequently to produce a uniform mixture. If possible, power mix for an additional 2-3 minutes. Avoid high mixing speeds which could entrap excessive amounts of air or cause overheating of the mixture resulting in reduced working life.
Apply the adhesive to all surfaces to be bonded and join together. In most applications only contact pressure is required.

Packaging

Bottles

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