One Component Epoxy Systems

E-linking one component epoxies offer easy application, increase productivity and eliminate waste.Specially formulated one component epoxy systems feature outstanding performance properties, long-term durability and easy application. These no mix compounds cure quickly at moderate temperatures. They are designed to increase productivity and eliminate waste.

Special Certifications for One Part Epoxy Compounds

Many of E-linkings one part adhesives, sealants and coatings are approved for use in various applications and industries. Additionally, specific grades meet the following certifications:

  • NASA low outgassing

  • USP Class VI for biocompatibility

  • Halogen free

Performance Properties

As with all products in the E-linking family, specific grades vary in viscosity, cure speed, chemical resistance and electrical properties, but can be custom formulated to meet your application needs.


Some Popular One Part Adhesives, Sealants, Coatings and Potting Compounds


Halogen Free, High Strength Epoxy Adhesive.Sag resistance,No flow during cure even on vertical surface; Halogen free,Environment friendly,High hot strength, Structural bonds at elevated temperatures.

ELINBOND E103ELINBOND E103 is a one component, thixotropic epoxy adhesive. It combines flexibility at temperatures down to -30°C with high peel and tensil e shear strength over a broad temperature range. ELINBOND E103 forms strong bonds to copper, aluminum, fiberglass reinforced plastics and oily steel.
ELINDUCT E323Ultra High thermal Conductivity, Die Attach Adhesive. Thixotropic, Excellent Dispensability; High strength, High reliability; High thermal conductivity, Provides a conductive heat path.
ELINDUCT E313-2‍‍‍‍‍‍‍‍Electrically Conductive Bonding Adhesive.Thixotropic, Low flow during cure; low volume resistivity, Excellent electrical conductivity; Fast curing, High output.
ELINOPTO E131Halogen Free, High Strength Epoxy Adhesive. Excellent resistance to water permeation, Extended life time of E-paper, OLED display; Very fast thermal cure at temperatures below 80°C, Energy saving ans low damage to devices; One component, No mixing required, easy to use.
ELINBOND E325Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards.

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