| ELINOPTO E131 | Halogen Free, High Strength Epoxy Adhesive. Excellent resistance to water permeation, Extended life time of E-paper, OLED display; Very fast thermal cure at temperatures below 80°C, Energy saving ans low damage to devices; One component, No mixing required, easy to use. |
| ELINBOND E203 | Test |
| ELINBOND E121-1 | Test |
| ELINBOND E107HF | Halogen Free, High Strength Epoxy Adhesive.Sag resistance,No flow during cure even on vertical surface; Halogen free,Environment friendly,High hot strength, Structural bonds at elevated temperatures. |
| ELINBOND A801 | One component,Ease of use Excellent adhesion,bonding to a wide variety of substrates Excellent compressive/tensile strength properties,Quick speed processing Fast cure |
| ELINBOND A108 | Low CTE,low stress Excellent adhesion,Structural bonding to a wide variety of substrates UV Cure,Quick speed UV processing |
| ELINBOND E113 | One component,Ease of use Excellent dielectric properties,Reliable electronic assemblies Fast curing at low temperature,High output and low Energy consumption
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| ELINBOND E3200C | One component, Ease of use Fast and low temperature cure,Fast production processing Sag resistant paste,Dispensable on verticalsurfaces Flexible and resilient,Excellent stress reduction and absorbing properties |
| ELINBOND E119 | Thixotropic,No flow during cure One component,Ease of use High flexibility,low-stress adhesive |
E-Linking's plastic bonding adhesives feature high bond strength
Ferrites
