E-linking’s epoxy underfill compounds feature high glass transition temperatures and resistance to shock.Designed to improve reliability, E-linking’s line of epoxy underfill compositions offer excellent underfill to die passivation as well as outstanding adhesion to a variety of substrates. They improve mechanical support, lower strain on solder joints and provide superior protection from moisture.
Applications for Epoxy Underfill Encapsulants
• Flip chip devices
• Ball grid arrays
• Chip scale packaging
Advantages of E-linking Underfill Systems
Both flowable and non-flow systems are available for use. Additionally, to improve efficiency of production snap cure and reworkable systems have been introduced. The key properties of theses systems include:
• High purity
• Low stress
• High adhesion
• Low coefficient of thermal expansion (CTE)
• Low outgassing
• High glass transition temperature (Tg)
• High Young’s modulus
• Moisture resistance
• Short cure cycle
• Structural stability
• Thermal cycling resistance
• Shock and vibration resistance
Display Assembly
