Underfill Encapsulants

E-linking’s epoxy underfill compounds feature high glass transition temperatures and resistance to shock.Designed to improve reliability, E-linking’s line of epoxy underfill compositions offer excellent underfill to die passivation as well as outstanding adhesion to a variety of substrates. They improve mechanical support, lower strain on solder joints and provide superior protection from moisture.

Applications for Epoxy Underfill Encapsulants

  • Flip chip devices

  • Ball grid arrays

  • Chip scale packaging

Advantages of E-linking Underfill Systems

Both flowable and non-flow systems are available for use. Additionally, to improve efficiency of production snap cure and reworkable systems have been introduced. The key properties of theses systems include:

  • High purity

  • Low stress

  • High adhesion

  • Low coefficient of thermal expansion (CTE)

  • Low outgassing

  • High glass transition temperature (Tg)

  • High Young’s modulus

  • Moisture resistance

  • Short cure cycle

  • Structural stability

  • Thermal cycling resistance

  • Shock and vibration resistance

Most Popular Products for Automotive Electronics

ELINBOND   E119Thixotropic ,No flow during cure

One component,Ease of use

High flexibility,low-stress adhesive

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