Flexible Adhesive For Plastics And Metals

Key Features

● One component, Ease of use

● Fast and low temperature cure,Fast production processing

● Sag resistant paste,Dispensable on verticalsurfaces

● Flexible and resilient,Excellent stress reduction and absorbing properties

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Product Description

ELINBOND E3200C is a very fast, low temperature curing, sag resistant, one component epoxy adhesive. It features good flexibility and excellent chemical and humidity resistance. ELINBOND E3200C bonds well to engineering  plastics such as polyimide, polyphenylene oxide, polybutylene terephthlate and polysulfone; silicon and metals such as copper and gold.


ELINBOND E3200C was designed as a chemically resistant, fast and low temperature curing adhesive for bonding dissimilar engineering plastic substrates. It’s special for in cartridge assembly.

Instructions For Use

Thoroughly read the information concerning health and safety contained in thisbulletin before using. Observe all precautionary statements that appear on the product label and/or contained in individual Material Safety Data Sheets (MSDS).

To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part. For information on proper substrate preparation, refer to the reprint “Good Adhesive Bonding Starts With Surface Preparation” available from E-LINKING. 

Apply the adhesive to all surfaces to be bonded and join together. In most applications only contact pressure is required.


CansDouble Barrel CartridgeFlexiPak™Gun ApplicatorPremixed & Frozen SyringeSyringes

Request Information

Discuss your application  Request a Technical Data Sheet  Request an MSDS

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