Non-Conductive, Elastic Silicone Die Attach Adhesive

Key Features

● Thixotropic,No flow during cure

● One component,Ease of use

● High flexibility,Low-stress adhesive

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Product Description

ELINBOND S109 is a one component, non-slump, heat  cured,  addition-curing,  transparent,  silicone adhesive and sealant. It is a ready-to-use thixotropic paste and provides primerless adhesion to a wide range of substrates. ELINBOND S109 cures to a low hardness and elastic bond line with excellent resistance to heat and excellent dielectric properties.


ELINBOND S109 is general-purpose adhesive for the electronics industry. It’s special designed for die attach which dissimilar stress is concerned.

Instructions For Use

Thoroughly read the information concerning health and safety contained in this bulletin before using. Observe all precautionary statements that appear on the product label and/or contained in individual Material Safety Data Sheets (MSDS). 

To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part. 

All surfaces must be clean and free of contaminants that will inhibit the cure of ELINBOND S109. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility. For information on proper substrate preparation, refer to the reprint "Good Adhesive Bonding Starts With Surface Preparation" available from E-LINKING.

Apply the adhesive to all surfaces to be bonded and join together. In most applications only contact pressure is required.


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