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tra Low Coefficient of Thermal Expansion

Published:2015-06-02Author:Sources:Views:1414
E-linking EP42HT-2LTE is often chosen for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat.

This system is notable for having a low coefficient of thermal expansion of 9-12 x 10-6in/in/°C. With a tensile lap shear strength of over 1,200 psi, it bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass and many plastics. EP42HT-2LTE features superior electrical insulation properties, chemical resistance and dimensional stability over the wide service temperature range of -60°F to +300°F. It also offers low linear (<0.01%) and volumetric (<0.1%) shrinkage upon curing, which is useful for potting and encapsulation applications.

Featuring a light cream color, EP42HT-2LTE is prepared using a non-critical 100 to 40 mix ratio by weight or a 100 to 50 mix ratio by volume. After mixing a 100 gram batch, its working life is 60-90 minute open time. This product is available in standard packaging with sizes ranging from ½ pint to 5 gallon kits.


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